PGB-650 epoxy resin filling machine AB component potting machine
Category:Automatic AB glue dispensing machine
Brand: D&H
Model:PGB-650
Applications:Led Display,Display Module,Electronic Products And Where Glue Potting Demanded Products
Suitable Material:AB crystal glue: Glue dropping application and potting application. AB glue potting for isolation (with fillers): Two components silicone , two parts of PU, AB glue epoxy and so on .
Video
Features
We Daheng Automation specialize in different types of potting and dispensing system. No matter what your resin application requirements look like: we can do most of them in our fully equipped lab. We can handle 1- and 2-component polyurethanes, epoxies, acrylics, silicones, temperature, humidity and UV curing materials. They can be from low- to high-viscosity, filled or unfilled and even high abrasive for thermal conductivity.
* Auto feeding : take use of vacuum pressure to feed materials into A&B tank separately.
* Tank Stirring : A and B tank configure with stirring motors and blades to prevent material sediment in the tank bottom .
* Heating : Tank , pipe , pumps are optional with heaters to assure the whole system can be heating from room temperature to 90°C adjustable.
* Vacuum : A &B tank vacuum for degas the bubble inside material .
* Dynamic mixing : Configuring dynamic motor and mixer to mix A and B fluids evenly.
* Tank Stirring : A and B tank configure with stirring motors and blades to prevent material sediment in the tank bottom .
* Heating : Tank , pipe , pumps are optional with heaters to assure the whole system can be heating from room temperature to 90°C adjustable.
* Vacuum : A &B tank vacuum for degas the bubble inside material .
* Dynamic mixing : Configuring dynamic motor and mixer to mix A and B fluids evenly.
1. Vacuum material-feeding system or diaphragm pump feeding system
2. High precision pump metering system
3. Dynamic/Static mixing system
4. Three-axis motion system
5. Programming control system.
Potting and encapsulation is the process of embedding electronic components & assemblies in a liquid resin (potting compounds) to protect them against rough environment conditions. Potting can be performed in atmosphere pressure or even under vacuum, if high voltage insulation and high temperature differences are needed. Encapsulation of parts will stop corrosion of metals and reduce damage caused by vibration and mechanical stress.
PGB-650 epoxy resin filling machine AB component potting machine
2. High precision pump metering system
3. Dynamic/Static mixing system
4. Three-axis motion system
5. Programming control system.
Potting and encapsulation is the process of embedding electronic components & assemblies in a liquid resin (potting compounds) to protect them against rough environment conditions. Potting can be performed in atmosphere pressure or even under vacuum, if high voltage insulation and high temperature differences are needed. Encapsulation of parts will stop corrosion of metals and reduce damage caused by vibration and mechanical stress.
PGB-650 epoxy resin filling machine AB component potting machine